Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) For Lighting Solutions And Method Of Manufacturing Thereof

ABSTRACT

The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED package having excellent heat dissipation and protection to the LED, thus extending the lifespan of the LED. Each of the SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuit electrically connected to the top or bottom lead frame and a LED electrically connected to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions.

RELATED APPLICATIONS

This application is a division of application Ser. No. 13/288,979 andclaims priority of U.S. Provisional Application No. 61/426,497, filed onDec. 22, 2010 and U.S. Provisional Application No. 61/452,632 filed onMar. 14, 2011.

FIELD OF INVENTION

The present invention relates to integrated microelectronic device. Inparticular, the present invention provides a Scalable Heat DissipatingMicroelectronic Integration Platform (SHDMIP), particularly for lightingapplications, with a good heat dissipation capability, thus longlifespan, and a method of manufacturing thereof.

BACKGROUND

Application of integrated microelectronic devices for lightingapplications includes solid-state lighting (SSL) applications, lightemitting diodes (LEDs), organic light emitting diodes (OLED), opticaldevices, and the like. Currently, the available manufacturing methods ofthe integrated microelectronic devices for lighting applications arecostly and non-standardized. As illustration, to manufacture LEDlighting solutions, LED dies manufacturers and/or integratorsmanufacture and configure plurality of single LED die into LED arrays.Simultaneously, semiconductor manufacturers will manufacture powerconversion for the LED arrays, and also manufacture LED protectiondevices in separate semiconductor packages. All of LED components arethen delivered to LED luminaire manufacturers, who will use allcomponents to assemble LED lighting solutions. Consequently, because ofsuch complicated manufacturing process, the LED lighting solutionssuffer from high manufacturing costs and are highly unreliable. Earlyfailures of LED lighting applications are indeed unavoidable, regardlessof the fact that the LED dies have long life span.

Besides high-manufacturing cost and poor manufacturing process, anotherimportant issue dealt with the integrated microelectronic devices forlighting applications is pertained to heat generated from the device anddissipation system thereof. Insufficient heat dissipation affectsperformance and reduces life span of the integrated microelectronicdevices for lighting applications. The insufficient heat dissipationleads to dimness, even early failure of most integrated microelectronicdevices for lighting applications.

US 2006/0054915 discloses a LED package which includes a heat conductivebase plate and a light emitting diode (LED) mounted thereon. The heatconductive base plate functions for heat dissipation. The LED packagefurther comprises contact electrodes disposed on a lower opaque layerwhich surrounds the heat conductive base plate.

SUMMARY

The following presents a simplified summary to provide a basicunderstanding of the present invention. This summary is not an extensiveoverview of the invention, and is not intended to identify key featuresof the invention. Rather, it is to present some of the inventiveconcepts of this invention in a generalised form as a prelude to thedetailed description that is to follow.

In one embodiment, the present invention provides a Sealable HeatDissipating Microelectronic Integration Platform (SHDMIP) package for alighting solution. Each SHDMIP package comprises: a dual lead frameassembly and a microelectronic lighting device. Each dual lead frameassembly comprises: a bottom lead frame and a top lead frame. The bottomlead frame has a centre, raised plateau, which defines a first heat sinkpad, so that the raised plateau is connected to the surrounding leadframe material along two opposed edges of the plateau. The top leadframe has a second heat sink pad, an anode and a cathode, with the anodeand cathode being disposed on opposed sides of the second heat sink pad.The microelectronic lighting device is mounted on the second heat sinkpad and electrically connected to the anode and cathode. Solder or gluedisposed on the first and second heat sink pads thermally connects themicroelectronic lighting device to the bottom lead frame for heatdissipation.

In the above embodiment, the dual lead frame assembly comprises aplurality of dual lead frame assemblies, with the bottom lead framesbeing connected to adjacent lead frames by tie bars and the top leadframes being similarly connected to adjacent lead frames by separate tiebars. In one aspect, a protection and driver circuit is electricallyconnected to the top lead frame of the dual lead frame assembly. Inanother aspect, the ties bars are trimmed to produce individual lightingdevice. In another aspect, the tie bars are selectively trimmed toproduce an array of lighting devices connected in series, parallel orcombination of series and parallel. In yet another aspect, the tie barsare selectively trimmed to produce an array of lighting devices and thearray is panel molded.

In another embodiment, the present invention provides a SHDMIP packagefor another lighting solution. Each SHDMIP package comprises: a duallead frame assembly and a microelectronic lighting device. The dual leadframe assembly comprises a bottom lead frame and a top lead frame. Eachof the bottom lead frame is formed with two T-shaped electrodes arrangedas mirror images and in a north-south manner, and two first heat sinksarranged in the east-west manner, with one heat sink on each side of theT-shaped electrodes. Each of the top lead frame has a middle, raisedplateau, which defines a second heat sink pad, and an anode and cathode;the anode and cathode are disposed on opposed sides of the second heatsink in a north-south manner. The microelectronic lighting device ismounted on the second heat sink pad and electrically connected to theanode and cathode. Solder on the T-shaped electrodes electricallyconnects the T-shaped electrode to the anode or cathode and solder orglue on first heat sinks thermally connects the microelectronic lightingdevice to the bottom lead frame for heat dissipation.

In the second embodiment, the dual lead frame assembly comprises aplurality of dual lead frame assemblies, with the bottom lead framesbeing connected to adjacent lead frames by tie bars and the top leadframes being similarly connected to adjacent lead frames by separate tiebars. In one aspect, a protection and driver circuit is disposed tobridge two limbs of the T-shaped electrodes in the north-south manner ineach lead frame assembly, thereby the protection and driver circuit iselectrically connected to the associated microelectronic lightingdevice, anode and cathode. In another aspect, the ties bars are trimmedto produce individual lighting devices, In another aspect, the tie barsare selectively trimmed to produce an array of lighting devicesconnected in series, parallel or combination of series and parallel. Inyet another aspect, the tie bars are selectively trimmed to produce anarray of lighting devices and the array of lighting devices is panelmolded.

In another aspect, the dual lead frame assembly is made from anelectrically conductive material selected from the following: metal,metal alloy or ceramic.

BRIEF DESCRIPTION OF THE DRAWINGS

This invention will be described by way of non-limiting embodiments ofthe present invention, with reference to the accompanying drawings, inwhich:

FIG. 1 shows a perspective view of a single SHDMIP LED package accordingto one embodiment of the present invention;

FIGS. 1A to 1G illustrate a flow diagram of manufacturing process of theSHDMIPE LED package of FIG. 1 in accordance with one embodiment of thepresent invention;

FIG. 2 shows a perspective view of a single SHDMIP LED package accordingto one embodiment of the present invention;

FIG. 2A is a plan view showing bottom lead frame of the SHDMIP LEDpackage with protection circuit mounted thereon;

FIG. 3A shows an exemplary design of a matrix of a plurality of bottomlead frames in accordance with one embodiment of the present invention;

FIG. 3B shows an exemplary design of a matrix of a plurality top leadframes in accordance with one embodiment of the present invention;

FIG. 4A illustrates a perspective view of an exemplary SHDMIP LED arrayaccording to one embodiment of the present invention;

FIG. 4B illustrates a perspective view of another exemplary SHDMIP LEDarray according to another embodiment of the present invention.

FIGS. 5A to 5F illustrate a flow diagram of manufacturing process of aSHDMIP LED array in accordance with one embodiment of the presentinvention;

FIG. 6 shows a perspective view of an exemplary SHDMIP LED array inaccordance with another embodiment of the present invention; and

FIG. 7 shows a perspective view of an exemplary SHDMIP LED array inaccordance with another embodiment of the present invention

DETAILED DESCRIPTION

The following descriptions of a number of specific and alternativeembodiments are provided to understand the inventive features of thepresent invention. It shall be apparent to one skilled in the art,however that this invention may be practiced without such specificdetails. Some of the details may not be described in length so as to notobscure the invention. For ease of reference, common reference numeralswill be used throughout the figures when referring to same or similarfeatures common to the figures.

The present invention provides a scalable heat dissipatingmicroelectronic integration platform for lighting applications. Thescalable heat dissipating microelectronic integration platform comprisesa dual lead frame assembly. The dual lead frame assembly comprises abottom lead frame and a top lead frame. The dual lead frame assembly canaccommodate many electronic components essential for assembly ofreliable and robust microelectronic device for lighting applications.

The present invention will now be further illustrated by referring tothe following examples of assembly of scalable heat dissipatingmicroelectronic integration platform, with LED as the lighting elements.The assembly will be referred as SHDMIP LED package. It is to beunderstood that the following examples do not limit the presentinvention in any way.

FIG. 1 illustrates a perspective view of a single SHDMIP LED package 001according to one embodiment of the present invention. The SHDMIP LEDpackage 001 of this embodiment comprises an LED die 002 encapsulatedwith a clear lens 003 and a dual lead frame assembly 004. The dual leadframe assembly 004 of this embodiment comprises a bottom lead frame 0041having a heat sink for heat dissipation and a top lead frame 0042comprising a cathode 0042A and an anode 0042B. The top lead frame 0042is attached on the bottom lead frame 0041 by a thermally conductive, butelectrically isolative, material, and subsequently, the top lead frame0042 is molded together with the bottom lead frame 0041.

In one embodiment, the top lead frame 0042 further comprises top tiebars 0042C.

In a further embodiment, the bottom lead frame 0041 may comprise bottomtie bars.

The LED die 002 is conductively attached to the top lead frame 0042,creating electrical connection for the cathode 0042A. It is preferable,but not limited to, that in this embodiment, the LED die 002 is solderedto the top lead frame 0042.

A protection and driver circuit 005 is integrated to the top lead frame0042 creating protection for the LED die 002. The LED die 002 and theprotection circuit 005 are wire bonded to the anode 0042B of the toplead frame 0042, creating electrical connection for the anode 0042B. Theclear lens 003 is then compression molded to cover the LED die 002 andthe protection and driver circuit 005, creating optical path for the LEDdie 002 and the protection and driver circuit 005.

As the top lead frame 0042 is thermally connected to the bottom leadframe 0041, the heat from the LED die 002 attached to the top lead frame0042 is dissipated to the heat sink of the bottom lead frame 0041. Assuch, the dual lead frame assembly 004 provides a good heat and powerdissipation for the LED die 002, expanding the lifespan of the LED die002.

FIG. 1A to FIG. 1G illustrate a flow diagram of manufacturing process ofthe SHDMIP LED package 002 in accordance with one embodiment of thepresent invention.

In FIG. 1A, a bottom lead frame 0041 having a heat sink 0041A isprovided.

In FIG. 1B, a thermally conductive, but electrically isolative, adhesionmaterial 0041B is disposed over the heat sink 0041A of the bottom leadframe 0041.

In FIG. 1C, a top lead frame 0042 is attached onto the bottom lead frame0041, forming a dual lead frame assembly 004. The top lead frame 0042comprises an anode 0042B and a cathode 0042A for external connection.Due to the thermally conductive, but electrically isolative, adhesionmaterial 0041B, the top lead frame 0042 is thermally connected, butelectrically isolated from, the bottom lead frame 0041.

In FIG. 1D, the dual lead frame assembly 004 is molded.

In FIG. 1E, a LED die 002 and a protection and driver circuit 005 areelectrically attached to the top lead frame 0042 of the dual lead frameassembly 004. This forms an electrical connection with the cathode 0042Aof the top lead frame 0042 of the dual lead frame assembly 004. In oneembodiment, solder is used to attach the LED die 002 and the protectionand driver circuit 005 to the top lead frame 0042.

In FIG. 1F, the LED die 002 and the protection and driver circuit 005are wire bonded to the anode 0042B of the top lead frame 0042. Thisestablishes an electrical connection between the LED die 002 and theanode 0042B as well as between the protection and driver circuit 005 andthe anode 0042B.

In FIG. 1G, a clear lens 003 is compression molded onto the top leadframe 0042 to protect and create an optical path for the LED die 002.The SHDMIP LED package 001 is thus provided.

A perspective view of a single SHDMIP LED 100 package according toanother embodiment of the present invention is shown in FIG. 2.Referring to FIG. 2 the SHDMIP LED package 100 of this embodimentcomprises a commercially available LED die 103 and a dual lead frameassembly 105. The lead frame assembly 105 comprises bottom lead frame101 having a first heat sink pad and top lead frame 102, which isthermally and electrically attached to the bottom lead frame 101. Thetop lead frame 102 comprises a second heat sink pad 1023, and externalconnection electrodes comprising an anode 1021 and a cathode 1022.

In another embodiment, the bottom lead frame also may comprise externalconnection electrodes comprising an anode and a cathode.

The LED die 103 is disposed over the top lead frame 102 of the leadframe assembly 105 and is thermally and electrically attached thereto,forming the SHDMIP LED package 100. The anode 1021 and the cathode 1022electrically connect the dual lead frame assembly 105 to the LED 103 aswell as provide external electrical connection for the lead frameassembly 105 and the LED 103.

It is preferable that a thermally and electrically conductive material,such as solder or glue, is dispensed onto the top lead frame 102 tothermally and electrically connect the LED die 103 to the top lead frame102 of the lead frame assembly 105. In another embodiment, electricalconnection between the LED die 103 and the top lead frame 102 can alsobe achieved via wire bonding. The thermal and electrical connectionbetween the LED 103 and the lead frame assembly 105 promotes heatconduction therebetween.

It is also desired that the SHDMIP LED package 100 of the presentinvention includes a protection circuit. The protection circuit furtherprotects the LED 103, thus improves the protection and the reliabilityof the SHDMIP LED package 100. In one embodiment, the protection circuitis disposed under the top lead frame 102 and electrically connectedthereto. In another embodiment, the protection circuit is disposed overthe bottom lead frame 101 of the lead frame assembly 105. A plan viewshowing the bottom lead frame 101 with protection circuit 201 mountedthereon is illustrated in FIG. 2A. The protection circuit 201 isattached onto the bottom lead frame by means of thermally andelectrically conductive material, such as solder or glue 202, or wirebonding, such that the protection circuit 201 is electrically connectedto the bottom lead frame 101, whereby heat conduction between theprotection device circuitry 201 and the bottom lead frame 101 isallowed.

The SHDMIP LED package 100 also comprises a driver circuit integrated tothe bottom lead frame of the lead frame assembly by means of thermallyconductive materials, such as solder or glue, or wire bonding. Thedriver circuit controls all components within the SHDMIP LED package100.

In another embodiment, the driver circuit can also be attached on thetop lead frame of the lead frame assembly.

The SHDMIP LED package of the present invention provides good heatdissipation as well as protection to the LED die. The top and bottomlead frames of the lead frame assembly is equipped with heat sink padsfor excellent heat dissipation. The LED die is thermally connected tothe second heat sink pad of the top lead frame so that the heatgenerated from the LED die is conducted to the second heat sink pad. Inthe meantime, the top lead frame, including the second heat sink pad, isconductively connected to the bottom lead frame having the first heatsink pad. With this manner, the heat generated from the LED die can befurther conducted to the bottom lead frame, providing excellent heatdissipation to the LED die, thus extending lifespan of the LED die.

The lead frame assembly further provides electrical connections betweenthe LED die and the protection circuit mounted on the bottom lead frameof the lead frame assembly, thus providing protection to the LED die.The electrical connection between the LED die and the protection circuitis described as follows: as the LED die is electrically connected to thetop lead frame, the LED die indeed is electrically connected to thebottom lead frame, and therefore to the protection device circuitry.Accordingly, the LED die is electrically protected by the protectioncircuit.

It is typically preferable that some single SHDMIP LED packages 100 arearranged in a row or matrix so as to realize a SHDMIP LED array forvarious lighting solutions. FIG. 3A shows an exemplary design of amatrix of a plurality of bottom lead frames 300 in accordance with oneembodiment of the present invention. In this embodiment, the pluralityof bottom lead frames 300 are made from copper. The matrix of theplurality of bottom lead frames 300 comprise a plurality of bottom leadframes 302 interconnected by plurality of bottom tie bars 301. Theplurality of bottom tie bars 301 comprise plurality of internal bottomtie bars 301A and plurality of edge bottom tie bars 301B.

FIG. 3B shows an exemplary design of a matrix of a plurality top leadframes 310 in accordance with one embodiment of the present invention.In this embodiment, the matrix of the plurality top lead frames 310 ismade from copper. The matrix of the plurality of top lead frames 310comprises a plurality of top lead frames 311 interconnected by aplurality of top tie bars 312. The plurality of top tie bars 312comprise a plurality of internal top tie bars 312A and a plurality ofedge top tie bars 312B.

The plurality of bottom tie bars and the plurality of top tie barselectrically interconnect the plurality of LED dies. The tie bars aretrimmed accordingly to put the plurality of LED dies in a series,parallel, anti-parallel or some combinations thereof, electricalconnection.

It is preferable that dimension of the matrix of the plurality of bottomlead frames and the matrix of the plurality of top lead frames are equalso that they can fit perfectly as they are attached together to form amatrix of a plurality of lead frame assemblies.

It is to be understood that the selection of copper for the top leadframes and the bottom lead frames in this embodiment is merely anexample, not a limitation. The top lead frames and the bottom leadframes can be made from any metals, alloys, ceramics or any othersuitable materials, such as ceramics.

FIG. 4A illustrates a perspective view of SHDMIP LED array 400 accordingto one embodiment of the present invention. The SHDMIP LED array 400comprises the matrix of the plurality of bottom lead frames 402, whereineach of the plurality of bottom lead frames 402 interconnected by theplurality of bottom tie bars 403, a plurality of protection devicecircuits electrically attached onto each of the plurality of top leadframes 404, each of the plurality of top lead frames 404 interconnectedby the plurality of top tie bars 405, and a plurality of LED die 406electrically wire-bonded to the matrix of the plurality of top leadframes 404. Each of the plurality of top lead frames 404 is thermallyconnected to each of the plurality of bottom lead frames 402, providingheat dissipation to the plurality of LED 406.

FIG. 4B illustrates a perspective view of SHDMIP LED array 420 accordingto another embodiment of the present invention. In this embodiment, aplurality of commercially available LED 421 is attached to a matrix ofplurality of dual lead frame assembly 422, comprising a matrix ofplurality of top lead frame 423 thermally attached to a matrix ofplurality of bottom lead frame 424. The SHDMIP LED array furthercomprises a plurality of protection and driver circuitries electricallyattached to the matrix of the plurality of bottom lead frame 424.

In a further embodiment, the matrix of plurality of top lead frame isboth thermally and electrically attached to the matrix of plurality oftop lead frame.

In another further embodiment, the plurality of protection and drivercircuitries can be integrated to the matrix of plurality of top leadframes.

The present invention also provides a method to manufacture SHDMIP LEDarray. In general, the method comprises the steps of providing a matrixof a plurality of bottom lead frames interconnected by a plurality ofbottom tie bars and a matrix of a plurality of top lead framesinterconnected by a plurality of top tie bars, electrically integratinga plurality of driver circuits to the matrix of the plurality of bottomlead frames or to the matrix of the plurality of top lead frames,electrically connecting a plurality of protection device circuitries tothe matrix of the plurality of bottom lead frames or to the matrix ofthe plurality of top lead frames, electrically connecting the matrix ofthe plurality of bottom lead frames and the matrix of the plurality oftop lead frames to form a matrix of plurality of lead frame assembly,and electrically connecting a plurality of LED dies to the matrix ofplurality of lead frame assembly.

FIGS. 5A to 5F illustrate a flow diagram of manufacturing process of theSHDMIP LED array 500 in accordance with one embodiment of the presentinvention.

In FIG. 5A, a matrix of a plurality of bottom lead frames 501interconnected by a plurality of bottom tie bars 502 is provided.Subsequently, over the matrix of the plurality of bottom lead frames501, a thermally conductive material, such as solder or glue, isdispensed.

In FIG. 5B, a plurality of protection circuits 511 is respectivelyconnected onto each of the matrix of the plurality of bottom lead frames501 by means of solder or any thermally conductive material. In anotherembodiment, the plurality of protection circuitry devices 511 can beattached onto each of the matrix of the plurality of bottom lead frames501 by means of wire bonding.

In a further embodiment, a plurality of driver circuits is singlyattached electrically onto each of the matrix of the plurality of bottomlead frames 501.

In FIG. 5C, a matrix of a plurality of top lead frames 521,interconnected by a plurality of top tie bars 522, is attached onto thematrix of the plurality of bottom lead frames 501, covering theplurality of protection device circuitries 511 thereon. The attachmentof the top lead frames 521 to the bottom lead frame 501 forms a matrixof a plurality of lead frame assemblies 531.

In FIG. 5D, the matrix of the plurality of lead frame assemblies 531undergoes cavity molding process 532, and subsequently thermalconductive materials 533, such as solder, is dispensed over the matrixof the plurality of lead frame assemblies 531. The cavity moldingprovides an individualized package molding for each of plurality of LEDdies as the plurality of tie bars are not molded.

After the solder is dispensed, in FIG. 5E, a plurality of LED dies 541are singly attached over the matrix of the plurality of lead frameassemblies 531, forming a SHDMIP LED array according to one embodimentof the present invention 540.

In FIG. 5F, some of the plurality of bottom tie bars 502 and theplurality of top tie bars 522 are trimmed to configure electricalconnection of the SHDMIP LED array 540 for any lighting solutions. Theelectrical connection of the SHDMIP LED array can be configured inseries, in parallel, in anti-parallel or in some combinations thereof.

As previously described, in another different embodiment, the pluralityof protection device circuitries can be attached to the plurality of toplead frames. Similarly, the plurality of driver circuits can be attachedto the plurality of top lead frames.

FIG. 6 shows an exemplary SHDMIP LED array 601 in accordance withanother embodiment of the present invention. In the present embodiment,once a matrix of plurality of lead frame assemblies 602 is formed, thematrix of the plurality of lead frame assemblies 602 is not subjected tocavity molding, but top and bottom tie bars of the matrix of theplurality of lead frame assemblies 602 are immediately trimmed toconfigure electrical connection of the SHDMIP LED array 601.Subsequently, the trimmed matrix of the plurality of lead frameassemblies 602 is subjected to panel molding 603, and a plurality of LEDdies 604 are then attached thereto. The panel molding 603 willencapsulate all interconnections by the plurality of tie bars. Thisconfiguration provides a flat LED package which can include holes foraccommodating screws or nuts/bolts so that the LED package can bemounted to flat surfaces.

FIG. 7 shows an exemplary SHDMIP LED array 701 in accordance withanother embodiment of the present invention. In the present embodiment,a matrix of plurality of lead frame assemblies 702 of the SHDMIP LEDarray 701 is not subjected to any molding at all. After the matrix ofthe plurality of lead frame assemblies 702 is formed, some of aplurality of bottom tie bars 703 and a plurality top tie bars 704 of thematrix of the plurality of lead frame assemblies 702 are immediatelytrimmed to configure electrical connection of the SHDMIP LED array 701.Plurality of LED dies 705 is then directly disposed over the bare matrixof the plurality of lead frame assemblies 702.

The present invention provides a SHDMIP LED package with an extendedlifespan compared to the prior art. The SHDMIP LED package of thepresent invention has excellent heat dissipation. Additionally, theSHDMIP LED package of the present invention also gives a betterprotection to the LED, thus guarantees the lifetime and function of theLED.

In addition, method to manufacture the SHDMIP LED package of the presentinvention is a standardized method that provides high rate ofintegration of between the LED dies and other circuitry devices. Asingle SHDMIP LED package of the present invention can accommodateplurality of circuitry devices, such as inverter, current/voltageprotection device and a LED die, yet size of the SHDMIP LED package canbe as small as 5 mm by 6 mm.

Various lighting solutions can be realized by configuring plurality ofSHDMIP LED package of the present invention in a row or matrix of leadframes interconnected by plurality of tie bars. The plurality of LEDdies can be electrically connected in series, parallel, anti-parallel orsome combinations thereof. To configure the electrical connection of theplurality of SHDMIP LED array, some of the tie bars present in leadframe of the SHDMIP LED array need to be trimmed accordingly. The leadframe assembly can accommodate and interconnect more than hundred LEDs,thereby it is cost effective to use such high density lead frameassembly. With the high-density lead frame, the SHDMIP LED package iseconomical to be manufactured; yet it is effective and reliable.

The above description illustrates various embodiments of the presentinvention along with examples of how aspects of the present inventionmay be implemented. While specific embodiments have been described andillustrated it is understood that many changes, modifications,variations and combinations thereof could be made to the presentinvention without departing from the scope of the present invention. Theabove examples, embodiments, instructions semantics, and drawings shouldnot be deemed to be the only embodiments, and are presented toillustrate the flexibility and advantages of the present invention asdefined by the following claims:

We claim:
 1. A Scalable Heat Dissipating Microelectronic IntegrationPlatform (SHDMIP) package for a lighting solution comprising: a duallead frame assembly comprising: a bottom lead frame having a centre,raised plateau, which defines a first heat sink pad, so that the raisedplateau is connected to the surrounding lead frame material along twoopposed edges of the plateau; and a top lead frame having a second heatsink pad, an anode and a cathode, with the anode and cathode beingdisposed on opposed sides of the second heat sink pad; and amicroelectronic lighting device mounted on the second heat sink pad andelectrically connected to the anode and cathode; wherein solder or gluedisposed on the first and second heat sink pads thermally connect themicroelectronic lighting device to the bottom lead frame for heatdissipation.
 2. A SHDMIP package according to claim 1, wherein the duallead frame assembly comprises a plurality of dual lead frame assemblies,with the bottom lead frames being connected to adjacent lead frames bytie bars and the top lead frames being similarly connected to adjacentlead frames by separate tie bars.
 3. A SHDMIP package according to claim2, further comprising a protection and driver circuit disposed on eachof the second heat sink pad, with each of the protection and drivercircuit being electrically connected to the associated microelectroniclighting device, anode and cathode.
 4. A SHDMIP package according toclaim 3, further comprising a lens formed to encapsulate eachmicroelectronic lighting device, protection/driver circuit andassociated electrical connections onto the top lead frame.
 5. A SHDMIPpackage according to claim 4, wherein the ties bars are trimmed toproduce individual lighting devices or the tie bars are selectivelytrimmed to produce an array of lighting devices connected in series,parallel or combination of series and parallel.
 6. A SHDMIP packageaccording to claim 2, wherein each dual lead frame assembly is disposedin a cavity mold for encapsulation but with the second heat sink pads,anodes and cathodes being exposed.
 7. A SHDMIP package according toclaim 6, further comprising a protection and driver circuit disposed oneach of the second heat sink pad, with each of the protection and drivercircuit being electrically connected to the associated microelectroniclighting device, anode and cathode; and a lens is formed to encapsulateeach microelectronic lighting device, protection/driver circuit andassociated electrical connections onto the top lead frame.
 8. A SHDMIPpackage according to claim 7, wherein the ties bars are trimmed toproduce individual lighting devices or the tie bars are selectivelytrimmed to produce an array of lighting devices connected in series,parallel or combination of series and parallel.
 9. A SHDMIP packageaccording to claim 2, wherein the tie bars are selectively trimmed toproduce an array of the dual lead frame assemblies connected in series,parallel or combination of series and parallel, and the array ofassemblies is encapsulated to produce a panel molding but with thesecond heat sink pads, anodes and cathodes being exposed.
 10. A SHDMIPpackage according to claim 9, further comprising a protection and drivercircuit disposed on each of the second heat sink pad, with each of theprotection and driver circuit being electrically connected to theassociated microelectronic lighting device, anode and cathode; and alens is formed to encapsulate each microelectronic lighting device,protection/driver circuit and associated electrical connections onto thetop lead frame.
 11. A Scalable Heat Dissipating MicroelectronicIntegration Platform (SHDMIP) package for a lighting solutioncomprising: a dual lead frame assembly comprising: a bottom lead frameformed with two T-shaped electrodes arranged as mirror images and in anorth-south manner, and two first heat sinks arranged in the east-westmanner, with one heat sink on each side of the T-shaped electrodes; anda top lead frame having a middle, raised plateau, which defines a secondheat sink pad, and an anode and cathode, with the anode and cathodebeing disposed on opposed sides of the second heat sink in a north-southmanner; and a microelectronic lighting device mounted on the second heatsink pad and electrically connected to the anode and cathode; whereinsolder on the T-shaped electrodes electrically connect the T-shapedelectrode to the anode or cathode and solder or glue on first heat sinksthermally connect the microelectronic lighting device to the bottom leadframe for heat dissipation.
 12. A SHDMIP package according to claim 11,wherein the dual lead frame assembly comprises a plurality of dual leadframe assemblies, with the bottom lead frames being connected toadjacent lead frames by tie bars and the top lead frames being similarlyconnected to adjacent lead frames by separate tie bars.
 13. A SHDMIPpackage according to claim 12, further comprising a protection anddriver circuit disposed to bridge two limbs of the T-shaped electrodesin the north-south manner in each lead frame assembly, thereby theprotection and driver circuit is electrically connected to theassociated microelectronic lighting device, anode and cathode.
 14. ASHDMIP package according to claim 13, wherein each dual lead frameassembly is disposed in a cavity mold for encapsulation but with thesecond heat sink pads, anodes and cathodes being exposed.
 15. A SHDMIPpackage according to claim 14, further comprising a lens formed toencapsulate each microelectronic lighting device onto the associated toplead frame.
 16. A SHDMIP package according to claim 15, wherein the tiesbars are trimmed to produce individual lighting devices or the tie barsare selectively trimmed to produce an array of lighting devicesconnected in series, parallel or combination of series and parallel. 17.A SHDMIP package according to claim 13, wherein the tie bars areselectively trimmed to produce an array of the dual lead frameassemblies connected in series, parallel or combination of series andparallel, and the array of assemblies is encapsulated to produce a panelmolding but with the second heat sink pads, anodes and cathodes beingexposed.
 18. A SHDMIP package according to claim 17, further comprisinga lens formed to encapsulate each microelectronic lighting device.
 19. ASHDMIP package according to claim 1, wherein the dual lead frameassembly is made from an electrically conductive material selected fromthe following: metal, metal alloy or ceramic.
 20. A SHDMIP package ofaccording to claim 11, wherein the dual lead frame assembly is made froman electrically conductive material selected from the following: metal,metal alloy or ceramic.